On LED packaging technology
fecha:2011-06-17 14:53
estado:para resolver
pregunta:admin
onductive) multi-chip combination, the base diameter of 31.75mm, light-emitting area is located in the center of a diameter of about (0.375 25.4) mm , can hold 40 LED die, the same time as the aluminum heat sink. This package using conventional die combination of high-density packaging, high luminous efficiency, low thermal resistance, high current under the high light output, but also a promising LED solid light.
Can be seen, the thermal characteristics of power type LED LED work directly aff
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