High-power LED packaging technology
fecha:2010-11-24 16:20
is a concrete manifestation of package. From the process in terms of compatibility and reduce production cost, LED chip design package design should be the same time, the chip design should take into account the package structure and process. Otherwise, the other chip manufacturing is completed, probably because of chip package structure need to be adjusted, resulting in longer product development cycle and process costs, and sometimes even impossible.
Figure 1 high-power white LED packaging
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