High-power LED packaging technology
fecha:2010-11-24 16:20
he package structure should be minimized thermal and optical interface, thereby reducing the package thermal resistance, improve the light efficiency. Finally, the paper design of LED lamps and packaging requirements are described.
Key words: solid-state white LED lighting, high-power LED package
I. Introduction
High-power LED package structure and process as complex and directly affect the use of LED performance and life, has been a research focus in recent years, especially in high-power wh
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