High-power LED packaging technology
fecha:2010-11-24 16:20
rectly handle the interface, would be difficult to get a good cooling effect. For example, room temperature, good interfacial contact with high temperatures may exist in the interface gap, the substrate warpage may also affect the local bonding and heat dissipation. The key to improve the LED package is to reduce the interface and the interface contact resistance and enhance heat dissipation. Therefore, the chip and the cooling thermal interface between the substrate material (TIM) selection is
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