High-power LED packaging technology
fecha:2010-11-24 16:20
In this paper, optical, thermal, electrical, reliability, etc., are reviewed in detail the high-power white LED packaging design and research progress, and key high-power LED packaging technology are reviewed. LED package design should be made with the chip design at the same time, and the need for light, heat, electricity, consider a unified structure and other properties. In the packaging process, although the material (thermal substrate, phosphor, potting materials) choice is important, but t
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