LED chip manufacturing process:
→ Cleaning → wafer coated transparent electrode layer transparent electrode pattern lithography → → → corrosion graphic lithography platform to glue → → → to glue dry etching annealing → → → SiO2 deposition lithography → SiO2 window graphics to plastic corrosion → → very graphic lithography → N → pre-cleaning coating stripping → → → P annealed coating very graphic lithography → → → cutting abrasive stripping → → → final test chip.
In fact, the production of wafer production process is very complex, after the show finished wafer, the next step began on the LED epitaxial films as electrode (P pole, N-pole), and then they start cutting with the laser LED epitaxial wafers (before cutting LED epitaxial wafers with a diamond knife, major), made into chips after taking different positions on the wafer parametric testing done at nine points, as shown:
1, mainly on the voltage, wavelength, brightness test, meet the normal standard parameters of the wafer shipments continue to do the next step, if this does not meet the relevant requirements of nine test wafers, put aside the other treatment.
2, wafer cut into chips, 100% visual inspection (VI / VC), the operator must use a multiple of 30 magnification under a microscope for visual inspection.
3, then use the automatic sorting machine according to the different voltage, wavelength, intensity forecast parameters of fully automated chip selection, testing and classification.
4, the final check on the LED chip (VC) and labeling. Chip area in the center of the blue film, blue film up to 5000 chips, but each must ensure that the number of blue chip membrane not less than 1000, the chip type, lot number, quantity, and optical measurement statistics recorded in the label on glossy paper attached to the back. Blue chips will make the final film of the target detection test with the first visual inspection of the same standard, to ensure the quality of chips arranged in neat rows and qualified. This made the LED chip (referred to on the market square pieces).
In the LED chip production process, some defective or worn electrode chip, sorting out, these are behind the bulk crystal, this time there are some in the blue membrane does not meet the normal requirements of chips shipped, naturally became the side plates or raw footage, etc.