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LED production process

para resolver punto de recompresa:0 - se queda para el fin del problema

General requirements:
a. purpose
b. scope of use
c. use of equipment
d,documents
e. operating standards
f, notes
g. quality requirements

First step:stent row
Before the step: expanding crystal
Temperature: 50-60 degrees Celsius, warm-up about ten minutes,when expand the temperature is set to 65-75 degrees Celsius.

Second step:. point glue

Adjust time of point glue 0.2-0.4 seconds ;Barometer knob 0.05-0.52mPa;adjust the dispensing knob resorted to plastic standard

Remove the plastic from refrigerator, thawing about thirty minutes, security thawed then Mix (20-30 minutes)

Silver plastic before the height of chips 1 / 3, up to 1 / 4 , the eccentric distance is less than 1 / 3 the diameter of the chip

Third step:Solid crystal

Solid crystal pen with solid crystal plane to maintain 30-45 degrees Celsius. forefinger down to the tip top

Solid crystal in order from top to bottom, left to right

Crystal pen with solid crystalline cements to frame, wrist insulated plastic center

Forth step:Solid crystal baking
Baking temperature of 150 degrees after roasting 1.5 hours
Fifth step:General defective solid crystal :
Solid lie, Solid leak ,Solid diagonal ,Small plastic ,Polycrystalline ,Chip damage ,Short mat (electrode off Flip Chip ,Silver plastic more than 1 / 3 height of glue chip (more glue) ;Adhesive joints
Sixth step:wire welding
Machine temperature of 170-220 degrees Celsius
Single wire: 220 degrees Double wire: 180 degrees
Wire bonding 715g
Wire arc higher than the chip height is less than 3 times the height of the chip
Spot diameter of the boll 2-3 times the diameter the board across. solder application electrodes 2 / 3 or more
atención total de 242 veces     preguntador: admin contesto  


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