leidejidian

Gold bonding wires content ≥ 99.99%, trace elements combined to add <0.01%. With that in high temperature, high speed bonding, smooth surface, welded into the ball, good corrosion resistance, conductivity and bonding superior performance characteristics, adapted to high temperature, high-speed, very high-speed devices. Are widely used in integrated circuit (IC) large-scale integrated circuit (LSI) industry, is an important material for microelectronics industry, as the connection between chip and lead frame line. In kind as the standard product, price more details please call Reid Electrical (Shenzhen) Co., Customer Service Hotline 0755-28114811