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• High light transmission
• High purity
* Have a certain adhesive for high-power LED package
Curing process
* Room temperature curing, curing non-product precipitation.
* Platinum catalytic process of hydrogen silane
* Addition (double)
Cured resin
* Low water absorption
• High optical transparency
• High dimensional stability
1, the application
This product is a high-purity two-component heat curing silicone materials. Mainly used in the manufacture of LED, protection film and micro-connection lines not subject to external damage, resistance to environmental pollution, humidity, shock, vibration and other effects, can be a wide range of temperature, humidity and harsh environmental conditions remain on the optical characteristics, mechanical and electrical properties of stability.
2, typical properties
Item
Number of values
Uncured properties
Appearance
Transparent flow of liquid
A group were 25 ℃ (mPa.s)
950
B group were 25 ℃ (mPa.s)
600
Mixture of 25 ℃ (mPa.s)
780
Mixed index (ND25)
1.49
Properties after curing
Cured state
Gelatinous
Cone penetration
60
Transmission rate% (wavelength 450nm 1mm thick)
99
Volume resistivity
1 × 1015
Dielectric constant (MHz)
3.5
Dissipation factor (MHz)
0.003
Ion content in ppm
Na +
0.2
K +
0.6
Cl-
0.5
3, the use of
3.1 The substrate surface should be clean and dry. Substrate surface can be heated to remove moisture; can use naphtha, methyl ethyl ketone oxime (MEK) or other appropriate solvent cleaning the substrate surface. There should not be used for substrate dissolution or corrosion of the solvent, should not use a residual solvent.
3.2 in accordance with the recommended mixing ratio - A: B = 1:1 (weight ratio), accurately weighed into a clean glass container and mix evenly. Mixed with high-speed mixing equipment, the heat generated by high-speed mixing has the potential to increase the temperature of gel to shorten the time.
3.3 in the fall of 10mmHg vacuum bubbles. Generally emerge in the distribution of bubble packaging material before. Allocated according to need after the procedure can increase the bubble off.
3.4 To ensure the operability of the compound, A, B mixture used in the 60 minutes.
3.5 the best conditions for curing and cured at 25 ℃ for 4 hours, 3-curing, completely cured for 24 hours; also heated at 50 ℃ for 60min cure. When the curing temperature is below 25 ℃, appropriate to extend the curing time or curing temperature will help to improve the product fully cured.
4, product packaging
4.1 The product, A, B two-component packaging.
4.2 The product with glass or plastic bottles, the specifications are 500g, 1000g packing.
4.3 The product packaging indicate the name, brand name, batch number, weight, manufacturer, manufacturing date.
5, storage shelf
5.1 The product should be kept below 20 ℃, avoid direct sunlight, dry and ventilated.
5.2 Any unused product should be re-sealed, the proposed nitrogen filled dry and clean after the sealed.
5.3 The product from the shelf for the 12 months from the date of manufacture. Stored at 0 ℃ or lower temperature, appropriate to extend the shelf.
High Power SMD silica gel (two-component silicone)
