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1, Wafe Table wafer table
XY Travel itinerary: 6 "X 6"
Resolution accuracy: 0.2mil/5mm
2, PCB Table Table
XY Travel itinerary: 6 "X 10"
3, Die Placement Accuracy precision chip placement
Accuracy pasting position X-Y: ± 0.5mil
q Rotary q rotation: ± 2 ~ 3 ° (under the LED chip size and use of the change)
4, Die Size & Wafer chip size and wafer
Die Chip: 7mil * 7mil to 40mil * 40mil
Wafer Wafer: 6 "
Die Type Chip Type: R, G, B, three-chip
Bond Force solid crystal pressure: 40gm ~ 200gm (programmable adjustable)
5, PR System Image Recognition System
Method Method: 256 grey levels gray
Detection Detector: ink blot / Chipping broken crystal / Cracked die crack crystal
Montior Display: touch screen touch screen
Montior resolution screen resolution: 1024 * 768
6, Optics System Optical System
Camera Camera: Solid state Solid
OPTICS Magnifier Optical magnification: 0.7 ~ 4.5 times
7, Cycle time (speed): 450MS/EA
UPH Capacity: 8.0 K / H
8, Program Storage Capacity program storage capacity
No. Of programs practically unlimited number of library storage: unlimited
1000chips/program: 1000 per program LED LED quantity
9, Equipment Require equipment requirements:
Voltage Voltage: AC220V/50HZ
Air source of compressed air: at least 6BAR
Vacuum source vacuum: 700mmHg (vacuum)
Power Consumption Power: 2000W
10, Dimensions and Weight size and weight
Size (D * W * H) Overall dimensions: length 1200MM * 1500MM width 1000MM * high
Weight Weight: 450KG
11, Missing Die crystal leakage detection system:
Vacuum Sensor Vacuum sensor / Photoelectricty Sensor Photoelectric sensor (OPTIONAL optional)
Automatic solid crystal
