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ubicación:página de inicio » oferta del producto » DB-8002-type LED automatic solid crystal
DB-8002-type LED automatic solid crystal
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Producto / Servicio: veces de vista:94DB-8002-type LED automatic solid crystal 
precio unitario: negociable  requisitación de precio
la minima cantidad pedida:  
la cantidad total de oferta:
plazo de entrega: entrega dentro de los días a partir de la fecha de pago de comprador
actualizar la fecha: 2013-01-23  válido hasta el dia:efectividad a largo plazo


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informaciones en detalle
DB-8002-type LED automatic pasting machine (solid crystal) is the LED production process used to bond the die to the lead frame on an automated equipment, LED packaging production line after the key equipment necessary for the process one.


Main technical characteristics

Chip sets institutions: the use of double linear guide and ball screw table structure, with high positioning accuracy and repeatability.

※ Effective stroke: 152 × 152mm
※ Repeat accuracy: ± 0.005mm


Dispensing institutions: the use of sophisticated mechanical structure for the amount of silver plastic to take control of the dispensing head easy to replace, applied to different size chips.

※ Z to stroke: 5mm Repeatability: ± 0.01mm
※ Y to travel: 50mm Repeatability: ± 0.005mm


Thimble institutions: the thimble eccentric bodies run more smoothly, softly, with a quick needle exchange capacity.

※ Maximum stroke: 2mm



Welding arm bodies: a unique four-bar linkage to ensure the accuracy of bonding, bonding pressure adjustable between 40 ~ 200g.

※ sticky film speed: 420ms / pasting cycle
※ pasting accuracy: ± 50μm θ Accuracy: ± 5 °
※ tip: pick up the surface of rotating arm: 90 ° rotation welding Arm
※ bonding pressure :40-200g adjustable



Transport sector: transmission parameters can be programmed to facilitate product replacement.

Image recognition system: Dual CCD chip can be identified bodies chip bonding alignment and monitoring of the situation.

On the feeding mechanism: for a variety of vertical support.

Cutting body: easy, accurate to receive material support box.


Main Specifications

Bonder indicators:
> Pasting speed: 420 ms / pasting cycle
> Pasting accuracy: ± 50μm (XY positioning) θ Accuracy: ± 5 °
> Chip size: 0.18 × 0.18mm-1 × 1mm
> Tip: Pick-type surface
> Rotating arm: 90 ° rotation welding Arm
> Bonding pressure :40-200g adjustable

Chip sets institutional indicators:
> Effective stroke: 152 × 152mm
Repeat All "Accuracy: ± 0.005mm ' Gd="〉重复精度:±0.005mm" closure_uid_gx0nw4="700">> Repeat All "Accuracy: ± 0.005mm

Dispensing institutional indicators:
> Z to the itinerary: 5mm
Repeat All "Accuracy: ± 0.01mm ' Gd="〉重复精度:±0.01mm" closure_uid_gx0nw4="703">> Repeat All "Accuracy: ± 0.01mm
> Y to travel: 50mm
Repeat All "Accuracy: ± 0.005mm ' Gd="〉重复精度:±0.005mm" closure_uid_gx0nw4="705">> Repeat All "Accuracy: ± 0.005mm

Thimble institutional indicators:
> Stroke: 2mm

Necessary facilities:
> Input voltage: ~ 220V ± 22V (50Hz)
> Total power: 2KW
> Air pressure :0.5-0 .6 MPa
> Vacuum: ≤-700mbar

Size and weight:
> Overall dimension: 1100mm × 850mm × 1760mm
> Weight: 800kg
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